Items |
Mass Production |
Prototypes |
|
|---|---|---|---|
Layers |
2~68L |
120L |
|
Max. Board Thickness |
10mm（394mil） |
14mm（551mil） |
|
Min.Width/Space |
Inner Layer |
2.2mil/2.2mil |
2mil/2mil |
Outer Layer |
2.5mil/2.5mil |
2.2mil/2.2mil |
|
Registration |
Same layer |
±1mil |
±0.8mil |
Layer to Layer |
±5mil |
±4mil |
|
Max. CopperThickness |
6oz |
30oz |
|
Min. HoleDiameter |
Mechanical |
0.15mm(6mil) |
0.1mm(4mil) |
Laser |
0.1mm(4mil) |
0.05mm(2mil) |
|
Max. Size(Finish Size) |
Single Board |
850mmX570mm |
1000mmX600mm |
Backplane |
1250mmX570mm |
1320mmX600mm |
|
Aspect Ratio(Finish Hole) |
Single Board |
20: 1 |
28:1 |
Backplane |
25:1 |
35:1 |
|
Material |
Lead / Halogen Free |
EM827, 370HR, S1000-2M, 185HR, IT180A, EM825, IT158, S1000H / S1155, R1566W, EM285， VT47. |
|
High Speed |
M8, M7, M6,TU872SLK, FR408HR,N4000-13 Series, MW4000, MW2000, TU933 |
||
High Frequency |
RO3003, RO4003, RO5880, RO4350, RO6002, Arlon Diclad 880 |
||
Others |
Dupont AP8535, Panasonic R-F775 |
||
Max. Board Thickness |
Lead Free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG. |
||
HDI |
4+N+4, Blind and Buried holes, Resin plugging, Any-layer HDI |
||
Lead Time
-
Quick turn from USA: 2-10 days
-
Quick turn from China: 5-15 days
-
Standard turn from China: 3 - 7 weeks
