PCB manufacturing capability

Items

     Mass production

  Prototypes

Layers

2~68L

120L

Max. Board Thickness

10mm（394mil）

14mm（551mil）

Min. Width/Space

Inner Layer

2.2mil/2.2mil

2mil/2mil

Outer Layer

2.5mil/2.5mil

2.2mil/2.2mil

Registration

Same layer

±1mil

±0.8mil

Layer to Layer

±5mil

±4mil

Max. Copper Thickness

6oz

30oz

Min. Hole
Diameter

Mechanical

0.15mm(6mil)

0.1mm(4mil)

Laser

0.1mm(4mil)

0.05mm(2mil)

Max. Size
(Finish Size)

Single Board

850mmX570mm

1000mmX600mm

Backplane

1250mmX570mm

1320mmX600mm

Aspect Ratio
(Finish Hole)

Single Board

20: 1

28:1

Backplane

25:1

35:1

Material

Lead / Halogen  Free

EM827, 370HR, S1000-2M, 185HR, IT180A, EM825, IT158, S1000H / S1155, R1566W, EM285， VT47.

High Speed

M8, M7, M6,TU872SLK, FR408HR,N4000-13 Series, MW4000,MW2000,TU933

High Frequency

RO3003, RO4003, RO5880, RO4350, RO6002, Arlon Diclad 880

Others

Dupont AP8535, Panasonic R-F775

Surface Finish

Lead Free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG

HDI

4+N+4, Blind and Buried holes, Resin plugging, Any-layer HDI