Rigid PCB

ItemsMass ProductionPrototypes
                 Layers     2~58L   68L
      Max. Board Thickness     10mm(394mil)   12mm(472mil)
      Min. Width/Space     Inner Layer     2.5mil/2.5mil   2mil/2mil
    Outer Layer     3mil/3mil   2.8mil/2.8mil
Registration    Book     ±2mil   ±1mil
   Layer to Layer     ±5mil   ±4.5mil
        Max. Copper Thickness     6oz   30Oz
Min. Hole
Diameter
   Mechanical     0.15mm(6mil)   0.1mm(4mil)
   Laser     0.1mm(4mil)   0.075mm(3mil)
Max. Size
(Finish Size)
   Single Board     850mmX570mm    1000mmX600mm
   Backplane    1250mmX570mm    1320mmX600mm
Aspect Ratio
(Finish Hole)
   Single Board     16: 1    20:1
    Backplane     22:1    25:1
Material    Lead/Halogen  FreeEM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, S1165, R1566W
    High SpeedMegtron6, Megtron4, TU872SLK, TU862HF, FR408HR, EM285, N4000-13 Series
    High FrequencyRo3003, Ro3006, Ro4350B, Ro2929, RO5880,  CLTE, Genclad, RF35, FastRise27
   OthersPolyimide, Tk, LCP, BT, C-ply, Fradflex, Ω-ply
Surface FinishHASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold, Gold Finger, Selective OSP, ENEPIG